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datasheet product structure silicon monolithic integrated circuit this product has not designed protection against ra dioactive rays 1/23 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 1 channel compact high side switch ics 1.3a current limit high side switch ics bd2268g-m bd2269g-m general description bd2268g-m and bd2269g-m are low on-resistance n-channel mosfet high-side power switches, optimized for universal serial bus (usb) applications. bd2268g-m and bd2269g-m are equipped with the function of over-current detection, thermal shutdow n, under-voltage lockout and soft-start. features aec-q100 qualified over current protection built-in low on-resistance (typ 110m ? ) n-channel mosfet thermal shutdown open-drain fault flag output under-voltage lockout output discharge function soft-start circuit control input logic active-high: bd2268g-m active-low: bd2269g-m applications car accessory, industrial applications key specifications input voltage range: 2.7v to 5.5v on-resistance: 110m ? (typ) over-current threshold: 1.15a (min), 1.4a (max) standby current: 0.01 a (typ) operating temperature range: -40c to +85c package w (typ) d (typ) h (max) typical application circuit lineup over-current detection min typ max control input logic package orderable part number 1150ma 1275ma 1400ma high ssop5 reel of 3000 BD2268G-MGTR 1150ma 1275ma 1400ma low ssop5 reel of 3000 bd2269g-mgtr s sop5 2.90mm x 2.80mm x 1.25mm 10k ? to 100k ? c l c in in gnd en out /oc 5v (typ ) + - 3.3v downloaded from: http:///
2/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 block diagram pin configurations in gnd en 1 2 3 4 5 /oc out in gnd /en 1 2 3 4 5 /oc out pin description pin no. symbol i/o function 1 in - switch input and the supply voltage for the i c 2 gnd - ground 3 en, /en i enable input en: high level input turns on the switch. (bd2268g-m) /en: low level input turns on the switch. (bd2269g-m) 4 /oc o over-current detection terminal. low level output during over-current or over-tempera ture condition open-drain fault flag output 5 out o switch output bd2268g-m top view over-current protection under-voltage lockout en(/en) in /oc gnd out /en delay counter charge pump thermal shutdown bd2269g-m top view downloaded from: http:///
3/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 absolute maximum ratings (ta=25c) parameter symbol rating unit in supply voltage v in -0.3 to +6.0 v en(/en) input voltage v en , v /en -0.3 to +6.0 v /oc voltage v /oc -0.3 to +6.0 v /oc sink current i /oc 5 ma out voltage v out -0.3 to v in + 0.3 v storage temperature tstg -55 to +150 c power dissipation pd 0.67 (note 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 5.4mw per 1c above 25c caution: operating the ic over the absolute maximum ratings ma y damage the ic. the damage can either be a short cir cuit between pins or an open circuit between pins and the internal circuitry. therefore, i t is important to consider circuit protection measures, su ch as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions rating parameter symbol min typ max unit in operating voltage v in 2.7 5.0 5.5 v operating temperature topr -40 - +85 c electrical characteristics bd2268g-m (v in = 5v, ta= 25c, unless otherwise specified.) dc characteristics limit parameter symbol min typ max unit conditions operating current i dd - 110 160 a v en = 5v v out = open standby current i stb - 0.01 5 a v en = 0v v out = open v enh 2.0 - - v high input en input voltage v enl - - 0.8 v low input en input leakage i en -1 +0.01 +1 a v en = 0v or 5v on-resistance r on - 110 155 m ? i out = 500ma over-current threshold i th 1150 1275 1400 ma short circuit output current i sc 500 - - ma v out = 0v, rms output discharge resistance r disc 30 60 120 ? i disc = 1ma /oc output low voltage v /oc - - 0.4 v i /oc = 0.5ma v tuvh 2.1 2.3 2.5 v v in increasing uvlo threshold v tuvl 2.0 2.2 2.4 v v in decreasing ac characteristics limit parameter symbol min typ max unit conditions output rise time t on1 - 1 6 ms r l = 100 ? output turn on time t on2 - 1.5 10 ms r l = 100 ? output fall time t off1 - 1 20 s r l = 100 ? output turn off time t off2 - 3 40 s r l = 100 ? /oc delay time t /oc 10 15 20 ms downloaded from: http:///
4/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 electrical characteristics - continued bd2269g-m (v in = 5v, ta= 25c, unless otherwise specified.) dc characteristics limit parameter symbol min typ max unit conditions operating current i dd - 110 160 a v /en = 0v v out = open standby current i stb - 0.01 5 a v /en = 5v v out = open v /enh 2.0 - - v high input /en input voltage v /enl - - 0.8 v low input /en input leakage i /en -1 +0.01 +1 a v /en = 0v or 5v on-resistance r on - 110 155 m ? i out = 500ma over-current threshold i th 1150 1275 1400 ma short circuit output current i sc 500 - - ma v out = 0v, rms output discharge resistance r disc 30 60 120 ? i disc = 1ma /oc output low voltage v /oc - - 0.4 v i /oc = 0.5ma v tuvh 2.1 2.3 2.5 v v in increasing uvlo threshold v tuvl 2.0 2.2 2.4 v v in decreasing ac characteristics limit parameter symbol min typ max unit conditions output rise time t on1 - 1 6 ms r l = 100 ? output turn on time t on2 - 1.5 10 ms r l = 100 ? output fall time t off1 - 1 20 s r l = 100 ? output turn off time t off2 - 3 40 s r l = 100 ? /oc delay time t /oc 10 15 20 ms downloaded from: http:///
5/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 measurement circuit vin gnd en(/en) vout /oc v in v en(/en) a 1f vin gnd en(/en) vout /oc v in v en(/en) a 1f r l a. operating current b. en, /en input voltage, output r ise / fall time vin gnd en(/en) vout /oc v in v en(/en) a 1f i out 10k ? vin gnd en(/en) vout /oc v in v en(/en) a 1f i oc c. on-resistance, over-current detection d. /oc out put low voltage figure 1. measurement circuit timing diagram t on1 t off1 90% 10% 10% t on2 t off2 v /enl v /enh 90% v /en v out figure 2. output rise / fall time (bd2268g-m) figure 3. output rise / fall time (bd2269g-m) t on1 t off1 90% 10% 10% t on2 t off2 v enh v enl 90% v en v out in out in out in out out in downloaded from: http:///
6/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 typical performance curves figure 4. operating current vs supply voltage (en, /en enable) 0 20 40 60 80 100 120 140 2 3 4 5 6 supply voltage : v in [v] operating current : i dd [ a] ta=25 c figure 5. operating current vs ambient temperature (en, /en enable) 0 20 40 60 80 100 120 140 -50 0 50 100 ambient temperature : ta[ ] operating current : i dd [ a] v in =5.0v figure 6. standby current vs supply voltage (en, /en disable) 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 supply voltage : v in [v] standby current : i stb [a] ta=25 c figure 7. standby current vs ambient temperature (en, /en disable) 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] standby current : i stb [ a] v in =5.0v operating current: i dd [a] ambient temperature: ta [c] supply voltage: v in [v] ambient temperature: ta [c] standby current: i stb [a] standby current: i stb [a] operating current: i dd [a] supply voltage: v in [v] downloaded from: http:///
7/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 typical performance curves - continued figure 8. en, /en input voltage vs supply voltage (v enh , v enl , v /enh , v /enl ) figure 9. en, /en input voltage vs ambient temperature (v enh , v enl , v /enh , v /enl ) 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] enable input voltage : v en [v] ta=25 c low to high high to low supply voltage: v in [v] enable input voltage: v en , v /en [v] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[ ] enable input voltage : v en [v] ambient temperature: ta [c] enable input voltage: v en , v /en [v] v in =5.0v low to high high to low figure 11. on-resistance vs ambient temperature 0 50 100 150 2 00 -50 0 50 10 0 a m b ient tem pera ture : ta[ ] ambient temperature: ta [c] on-resistance: r on [m ? ] v in =5.0v figure 10. on-resistance vs supply voltage 0 50 100 150 200 2 3 4 5 6 supply volta ge : v i n [ v ] supply voltage: v in [v] on-resistance: r on [m ? ] ta=25 c downloaded from: http:///
8/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 typical performance curves - continued figure 12. over-current threshold vs supply voltage 0.9 1.0 1.1 1.2 1.3 1.4 1.5 2 3 4 5 6 supply voltage : v in [v] over current threshold:i th [a] ta=25 c figure 13. over-current threshold vs ambient temperature 0.9 1.0 1.1 1.2 1.3 1.4 1.5 -50 0 50 100 ambient temperature : ta[ ] over current threshold:i th [a] v in =5.0v supply voltage : v in [v] /o c ambient temperature : ta[ ] supply voltage: v in [v] ambient temperature: ta [c] over-current threshold: i th [a] over-current threshold: i th [a] figure 14. /oc output low voltage vs supply voltage 0 20 40 60 80 100 2 3 4 5 6 ta=25 c supply voltage: v in [v] /oc output low voltage: v /oc [mv] figure 15. /oc output low voltage vs ambient temperature ambient temperature: ta [c] 0 20 40 60 80 100 -50 0 50 100 v in =5.0v /oc output low voltage: v /oc [mv] downloaded from: http:///
9/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 typical performance curves - continued figure 16. uvlo threshold voltage vs ambient temperature 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature : ta[ ] uvlo threshold : v tuvh , v tuvl [v] v tuvh v tuvl ambient temperature: ta [c] uvlo threshold: v tuvh, v tuvl [v] figure 17. uvlo hysteresis voltage vs ambient temperature 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] uvlo hysteresis voltage:v h sy [v] ambient temperature: ta [c] uvlo hysteresis voltage: v hys [v] figure 18. output rise time vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] rise time : t on1 [ms] ta=25 c supply voltage: v in [v] output rise time: t on1 [ms] figure 19. output rise time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] rise time : t on1 [ms] v in =5.0v ambient temperature: ta [c] output rise time: t on1 [ms] downloaded from: http:///
10/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 typical performance curves - continued figure 20. output turn on time vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] turn on time : t on2 [ms] ta=25 c figure 21. output turn on time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] turn on time : t on2 [ms] v in =5.0v figure 22. output fall time vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] fall time : t off1 [s] ta=25 c figure 23. output fall time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] fall time : t off1 [ s] v in =5.0v supply voltage: v in [v] ambient temperature: ta [c] supply voltage: v in [v] ambient temperature: ta [c] output fall time: t off1 [s] output fall time: t off1 [s] output turn on time: t on2 [ms] output turn on time: t on2 [ms] downloaded from: http:///
11/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 typical performance curves - continued figure 24. output turn off time vs supply voltage figure 25. output turn off time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2 3 4 5 6 supply voltage : v in [v] turn off time : t off2 [ s] ta=25 c supply voltage: v in [v] output turn off time: t off2 [s] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 0 50 100 ambient temperature : ta[ ] turn off time : t off2 [ s] v in =5.0v ambient temperature: ta [c] output turn off time: t off2 [s] figure 26. /oc delay time vs supply voltage 10 12 14 16 18 20 2 3 4 5 6 supply voltage : v in [v] /oc ddlay time : t /oc [ms] ta=25 c /oc delay time: t /oc [ms] supply voltage: v in [v] figure 27. /oc delay time vs ambient temperature 10 12 14 16 18 20 -50 0 50 100 ambient temperature : ta[ ] /oc ddlay time : t /oc [ms] v in =5.0v /oc delay time: t /oc [ms] ambient temperature: ta [c] downloaded from: http:///
12/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 typical performance curves - continued figure 28. output discharge resistance vs supply voltage figure 29. output discharge resistance vs ambient temperature 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] disc on resistance : r disc [ ] ta=25 c supply voltage: v in [v] output discharge resistance: r disc [ ? ] 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] disc on resistance : r disc [ ? ] v in =5.0v ambient temperature: ta [c] output discharge resistance: r disc [ ? ] downloaded from: http:///
13/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 time(1ms/div.) figure 30. output rise characteristic time(1 s/div.) figure 31. output fall characteristic v en (5v/div.) v /oc (5v/div.) v out (5v/div.) v in =5v r l =100 ? v en (5v/div.) v /oc (5v/div.) v out (5v/div.) v in =5v r l =100 ? i out (50ma/div.) i out (50ma/div.) typical wave forms (bd2268g-m) time (5ms/div.) figure 33. over-current response ramped load v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v time (1ms/div.) figure 32. inrush current response v in =5v r l =100 ? (5v/div.) v en i in (0.2a/div.) v /oc (5v/div.) c l =47 f c l =100 f c l =220 f downloaded from: http:///
14/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 typical wave forms - continued time (5ms/div.) figure 34. over-current response enable to short circuit v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v time (100ms/div.) figure 35. over-current response enable to short circuit v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v time (5ms/div.) figure 36. over-current response 1 ? load connected at en v /oc (5v/div.) v out (5v/div.) i out (1a/div.) v in =5v time (10ms/div.) figure 37. uvlo response when increasing v in r l =100 ? v in (5v/div.) v out (5v/div.) i out (50ma/div.) downloaded from: http:///
15/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 typical wave forms - continued time (10ms/div.) figure 38. uvlo response when decreasing v in r l =100 ? v in (5v/div.) v out (5v/div.) i out (50ma/div.) downloaded from: http:///
16/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 typical application circuit controller 10k ? to 100k ? c l c in vin gnd en(/en) vout /oc 5v (typ.) + - application information when excessive current flows due to output short-ci rcuit or so, ringing occurs by inductance of power source line and ic. this may cause bad effects on ic operations. in ord er to avoid this case, a bypass capacitor (c in ) should be connected across the in terminal and gnd terminal of ic. a 1 f or higher value is recommended. moreover, in orde r to decrease voltage fluctuations of power source line and ic, c onnect a low esr capacitor in parallel with c in. a 10 f to 100 f or higher is effective. pull up /oc output by resistance 10k ? to 100k ? . set up values for c l which satisfies the application. this application circuit does not guarantee its ope ration. when using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including ac/dc characteristics as well a s dispersion of the ic. functional description 1. switch operation in terminal and out terminal are connected to the d rain and the source of switch mosfet respectively. t he in terminal is also used as power source input to internal cont rol circuit. when the switch is turned on from en(/en) control inp ut, the in and out terminals are connected by a 110 m ? (typ) switch. in on status, the switch is bidirectional. therefore, when the potential of out terminal is hi gher than that of in terminal, current flows from out to in terminal. 2. thermal shutdown circuit (tsd) if over-current would continue, the temperature of the ic would increase drastically. if the junction temperature goes beyond 135c (typ) in the condition of over-current detection, thermal shutdown circuit operates and tu rns power switch off, causing the ic to output a fault flag (/oc). t hen, when the junction temperature decreases lower than 115c (typ), the power switch is turned on and fault flag (/oc) is cancelled. this operation repeats, unless the in crease of chips temperature is removed or the output of power switc h is turned off. the thermal shutdown circuit operates when the swit ch is on (en(/en) signal is active). 3. over-current detection (ocd) the over-current detection circuit limits current ( i sc ) and outputs fault flag (/oc) when current flowing in each switch mosfet exceeds a specified value. the over-current de tection circuit works when the switch is on (en(/en) signal is active). there are three types of response against over-current: (1) when the switch is turned on while the output i s in short circuit status, the switch goes into cur rent limit status immediately. (2) when the output short-circuits or high capacity load is connected while the switch is on, very lar ge current flows until the over-current limit circuit reacts. when the current detection and limit circuit operat es, current limitation is carried out. (3) when the output current increases gradually, cu rrent limitation would not operate unless the outpu t current exceeds the over-current detection value. when it e xceeds the detection value, current limitation is c arried out. (typ) in out downloaded from: http:///
17/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on unt il the v in exceeds 2.3v(typ). if v in drops below 2.2v(typ) while the switch is still on, then uvlo shuts off the power sw itch. uvlo has a hysteresis of 100mv(typ). under-voltage lockout circuit operates when the swi tch is on (en(/en) signal is active). 5. fault flag (/oc) output fault flag output is n-mos open drain output. during detection of over-current and/or thermal shutdown, the output level will turn low. over-current detection has delay filter. this delay filter prevents current detection flags from being sent during instantaneous events such as inrush current at swit ch on or during hot plug. if fault flag output is u nused, /oc pin should be connected to open or ground line. figure 39. over-current detection v en v out i out v /oc output s hort c ircuit thermal s hutdown /oc delay time figure 40. over-current detection, thermal shutdown timing (bd2268g-m) v /en v out i out v /oc output short circuit thermal s hutdown /oc delay time figure 41. over-current detection, thermal shutdown timing (bd2269g-m) v out i out v /oc t /oc over current detection i sc over current load removed i th downloaded from: http:///
18/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 power dissipation (ssop5 package) figure 42. power dissipation curve (pd-ta curve) i/o equivalence circuit symbol pin no. equivalence circuit en (/en) 3 en (/en) out 5 vout /oc 4 /oc 70mm x 70mm x 1.6mm glass epoxy board 85 out 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 ambient temperature : ta [ ] power dissipation : pd [mw] power dissip ation : p d [ mw ] ambient temperature : ta[c] downloaded from: http:///
19/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse po larity when connecting the power supply, such as mounting an ex ternal diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedan ce supply lines. separate the ground and supply line s of the digital and analog blocks to prevent noise in the g round and supply lines of the digital block from af fecting the analog block. furthermore, connect a capacitor to ground a t all power supply pins. consider the effect of tem perature and aging on the capacitance value when using electroly tic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient co ndition. 4. ground wiring pattern when using both small-signal and large-current grou nd traces, the two ground traces should be routed s eparately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that th e ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedanc e. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may re sult in deterioration of the properties of the chip. the ab solute maximum rating of the pd stated in this speci fication is when the ic is mounted on a 70mm x 70mm x 1.6mm glass ep oxy board. in case of exceeding this absolute maxim um rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approxim ately obtained. the electrical characteristics are guaran teed under the conditions of each parameter. 7. in rush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inr ush current may flow instantaneously due to the interna l powering sequence and delays, especially if the i c has more than one power supply. therefore, give spe cial consideration to power coupling capacitance, power wiring, width of ground wiring, and routing o f connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electro magnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connec ting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitor s completely after each process or step. the ics p ower supply should always be turned off completely before conne cting or removing it from the test setup during the inspection process. to prevent damage from static discharge, g round the ic during assembly and use similar precau tions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct w hen mounting the ic on the pcb. incorrect mounting ma y result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid e nvironment) and unintentional solder bridge deposited in betwee n pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high im pedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the tr ansistor and cause unexpected operation of the ic. so unless othe rwise specified, unused input pins should be connec ted to the power supply or ground line. downloaded from: http:///
20/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 operational notes - continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p subs trate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersecti on of the p layers with the n layers of other eleme nts, creating a parasitic diode or transistor. for example (refer t o figure below): when gnd > pin a and gnd > pin b, the p-n junction ope rates as a parasitic diode. when gnd > pin b, the p-n junction operates as a para sitic transistor. parasitic diodes inevitably occur in the structure o f the ic. the operation of parasitic diodes can res ult in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p subs trate) should be avoided. figure 43. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the diele ctric constant considering the change of capacitanc e with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit tha t prevents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if how ever the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically re stored to normal operation. note that the tsd circuit operates in a situation th at exceeds the absolute maximum ratings and therefo re, under no circumstances, should the tsd circuit be used in a s et design or for any purpose other than protecting the ic from heat damage. 15. thermal design perform thermal design in which there are adequate margins by taking into account the power dissipatio n (pd) in actual states of use. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
21/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 ordering information b d 2 2 6 8 g - m g t r part number package g: ssop5 product rank m: for automotive packaging and forming specification g: halogen free tr: embossed tape and reel b d 2 2 6 9 g - m g t r part number package g: ssop5 product rank m: for automotive packaging and forming specification g: halogen free tr: embossed tape and reel marking diagram part number part number marking bd2268g-m qw bd2269g-m qx part number marking ssop5 (top view) lot number downloaded from: http:///
22/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 physical dimension, tape and reel information package name ssop5 downloaded from: http:///
23/23 bd2268g-m bd2269g-m datas heet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r5r0h300120-1-2 24.feb.2014 rev.001 revision history date revision changes 24.feb.2014 001 new release downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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